Infineon Technologies A.G. reshuffled the technology deck last week, packing up both its joint venture 300mm-wafer fab in Singapore and its 130- and 90nm process technology partnership with Taiwan ...

Infineon Technologies A.G. has joined Advanced Micro Devices Inc. (AMD) and United Microelectronics Corp. (UMC) in a bid to develop one of the industry's most advanced manufacturing platform ...

Infineon Technologies has disclosed its latest milestone in semiconductor manufacturing technology, following the announcement of the world's first 300-millimeter GaN power wafer and the inauguration ...

(RTTNews) - German semiconductor maker Infineon Technologies AG (IFNNY) announced Wednesday the development of the world's first 300 mm power gallium nitride or GaN wafer technology. The ...

Infineon has unveiled the world’s thinnest silicon power wafers, with a thickness of 20 micrometers and a diameter of 300 millimeters. The company said the newly produced wafers are half as thick as ...

Semiconductor makers STMicroelectronics and Infineon have teamed with 3D packaging provider STATS ChipPAC to jointly develop the next generation of embedded Wafer-Level Ball Grid Array (eWLB) ...

Infineon has signed a SiC wafer supply deal with SK Siltron. “For Infineon, supply chain resiliency is about implementing a multi-supplier strategy and drive decarbonisation,” said Angelique van der ...

SK Siltron, a subsidiary of SK Group, has signed a long-term contract with German semiconductor company Infineon to supply silicon carbide (SiC) wafers. According to ET News, SK Siltron's subsidiary, ...

The "Thin Wafer Market Report 2026" has been added to ResearchAndMarkets.com's offering.The thin wafer market is experiencing robust growth, poised to expand from $12.57 billion in 2025 to $19.45 ...

The big picture: Infineon has developed the world's thinnest silicon power wafers, measuring just 20 micrometers in thickness – about the same as a human hair. These wafers promise significant ...

The European Commission (EC) has approved a €920 million ($964m) funding package to support the construction of Infineon’s new chip fab in Dresden, Germany. The funding will allow the German chipmaker ...