Technological innovation remains the backbone of Japan’s aluminium bottle market expansion. From digital printing and advanced coating techniques to barrier technology and shape memory alloys, ...

ASE Technology Holding (ASEH) plans to follow in TSMC's footsteps by establishing an advanced packaging fab in Kyushu, Japan, according to industry sources. Save my User ID and Password Some ...

Samsung Electronics (OTC:SSNLF) earmarked 25 billion yen ($170 million) to establish an advanced chip packaging R&D center in Yokohama, Japan, intensifying its competition with Taiwan Semiconductor ...

TAICHUNG, Taiwan, Jan 16 (Reuters) - Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said ...

From preserving fruits and vegetables to storing ready-made meals, food cans have long been a staple of kitchens across the globe. But behind their familiar metal exterior lies a history of innovation ...

SEMI Japan president Masayuki Hamajima recently called for the semiconductor industry to unify packaging technology standards as soon as possible, particularly in the advanced packaging sector. A ...

Within the material category, polypropylene is the clear frontrunner, accounting for more than three-quarters of the market and expected to grow further by 2035. Its lightweight properties, ease of ...