Engineers at FPGA manufacturer Xilinx had a measurement challenge: how to characterize the 28Gb/s serial links in their devices. At such a data rate, even very short connections can cause signal ...

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...

Concurrent design of a chip and its packaging environment is becoming more important than ever for several reasons. Designing a large, high power die, e.g. a System-on-Chip (SoC), without considering ...

The Package Thermal Analysis Calculator (PTA) aids in the analysis of the thermal properties of integrated circuit packages. These include thermal resistance, power dissipation, and die, package, and ...

Whether it is the need for sustainable energy, or driving performance while keeping power at bay, or enabling safe and reliable operation of any electronic system, containment of electronic noise — ...