Electronics components are steadily moving away from through hole parts to using surface mount technology (SMT) exclusively. While the small size of the SMT components can be intimidating, with a ...

Unsatisfied with the standard fare of soldering practice kits that offer little to no purpose once they’re built, [Jim Heaney] decided to take matters into his own hands and design an easy-to-assemble ...

Fujitsu Limited announced that it has developed new technology that enables formation of ultrafine pitch 35 micron (center-to-center distance of bumps) solder bumps (*1), and high-precision flip-chip ...

Many factors affect the long-term reliability of ceramic-substrate-based chip resistors. Among those are changes in resistance due to soldering, temperature changes, or even the expected shifts in ...