Glass more than half full.

Interposers and substrates are undergoing a profound transformation from intermediaries to engineered platforms responsible for power distribution, thermal management, high-density interconnects, and ...

LG Innotek to participate in ECTC for the first time in 2026, joining 135 leading global semiconductor companies; To exhibit ...

NIMS discovered a phenomenon in which droplets on a single solid surface exhibit both a "sticky" and "repellent" state ...

Researchers at Chalmers University of Technology have demonstrated a material engineering approach that enhances ...

Nikon ASML lithography competition intensified on May 29 as CEO Yasuhiro Ohmura announced lower-priced ArF immersion tools to challenge ASML’s 80%-plus market share, while Intel and 3D Glass Solutions ...

Substrate inhibition is a longstanding bottleneck in microbial fermentation, particularly in lactic acid bacteria, where ...