For 60 years, Gordon Moore's observation that transistor counts in integrated circuits would double roughly every two years has been spookily accurate. Ever-smaller transistors and ever-larger chips ...

Developed core technology that will allow practical implementation of high-density, low-power 3D DRAM, presented at IEEE International Electron Devices Meeting (IEDM) ...

Silicon chip manufacturers like Intel and TSMC are constantly outdoing themselves to make ever smaller features, but they are getting closer to the physical limits of silicon. “We already have very, ...

IBM and Samsung have announced their latest advance in semiconductor design: a new way to stack transistors vertically on a chip (instead of lying flat on the surface of the semiconductor). The new ...

After nearly a decade and five major nodes, along with a slew of half-nodes, the semiconductor manufacturing industry will begin transitioning from finFETs to gate-all-around stacked nanosheet ...

The sub-1 nm chip technology is already in sight, and imec’s ITF World event in Antwerp, Belgium provided a sneak peek into the major process nodes and transistor architectures serving sub-1 nm with ...

Not since Neil Armstrong took his first steps on the moon has the transistor seen such a dramatic change, and that change holds some big promises. "Intel has developed a complete high-k plus ...

Semiconductor chips have been getting smaller and smaller every year since the 1960s, with double the number of transistors fitting into the same chip space each year following the predicted ...