A new technical paper titled “Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies” was published by researchers at Arizona State University. Abstract ...

Infineon Technologies AG announces its 200 mm silicon carbide (SiC) manufacturing capability, with initial product releases ...

According a report from the Wall Street Journal, the factory partnership could involve TSMC potentially sending engineers to one of Intel’s chip fabs to apply their expertise and “ensure its viability ...

From high-speed communication to quantum computing and sensing, the detection, transmission, and manipulation of light ...

Infineon Technologies has announced significant progress along its 200 mm SiC roadmap, with customers receiving the first ...

Good morning, everyone. Welcome to the Conference Call for Analysts and Investor for 2025 First Fiscal Quarter Results of Infineon. Today's call will be hosted by Alexander Foltin, Executive Vice ...

ACM Research is a promising investment opportunity with strong growth prospects and undervalued potential. Click here to read ...

It is unclear if this project will continue after the suspension. Sumitomo canceled its wafer fab project due to weak demand in the electric vehicle (EV) market and uncertainty regarding recovery ...

One Twinscan NXE:3800E scanner can process up to 220 wafers per hour at a dose of 30mj/cm^2, or 5280 wafers per 24 hours, assuming that it is available all the time, which does not usually happen ...

While USB-C chargers and adapters have been the forerunners, GaN is now on its way to reaching tipping points in its adoption in further industries, substantially driving the market for GaN-based ...

using high-intensity light in a process called photolithography. The result is called an integrated circuit. Many wafers contain multiple copies of a single type of integrated circuit, which are ...