Semiconductor Engineering6h
Chip Industry Investments Kept Flowing In 2024 Even As Some Projects Stalled
Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form ...
Semiconductor Engineering19h
3D Integration And Test Results From TSV-Processed Chips (CERN et al.)
A new technical paper titled “3D integration of pixel readout chips using Through-Silicon-Vias” was published by researchers ...
Semiconductor Engineering19h
Impact of Extremely Low Temperatures On The 5nm SRAM Array Size and Performance
A new technical paper titled “Novel Trade-offs in 5 nm FinFET SRAM Arrays at Extremely Low Temperatures” was published by ...
Semiconductor Engineering19h
Liquid-Infused Nanostructured Composites As A Universal Thermal Interface Solution for Cooling Applications
A new technical paper titled “Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling” was published by researchers at Carnegie Mellon University ...
Semiconductor Engineering20h
Vertical AlGaN Heterostructures For Integrated Photonics
A new technical paper titled “AlGaN/AlN heterostructures: an emerging platform for integrated photonics” was published by researchers at Humboldt-Universität zu Berlin and Ferdinand-Braun-Institut ...