Design And Reuse

Analog Bits Demonstrates Real-Time On-Chip Power Sensing and Delivery on TSMC N2P Process at TSMC 2026 Technology Symposiums

Analog Bits continues to develop innovative mixed signal IP in TSMC N2P process technology, with integrated LDOs, pinless remote PVT sensors, and microwatt class and high-performance LC PLLs​​​​​​​ ...
Design And Reuse

OmniTrust and Synopsys collaboration enables earlier security validation of embedded systems

As embedded systems become increasingly software-driven, development workflows have shifted earlier through virtualization and electronics digital twin technologies. However, key security checks, such ...
Design And Reuse

Codasip Shifts Focus to Cyber-Resilient SoCs, Divests Low-End RISC-V Business

Codasip announced it will put more focus of its business into cyber-resilient semiconductor architectures and semiconductor System on Chips (SoCs). Because of the change, the company will divest its ...
Design And Reuse

Socionext Collaborates with Arm to Advance AI Data Center Infrastructure with Arm Total Design

Ecosystem-Driven Design with Socionext Flexlets Enables Flexible, High-Performance Silicon Platforms for Advanced Automotive, Compute, and AI Systems. Langen/Germany, Yokohama, Ja ...
Design And Reuse

SiFive Raises $400 Million to Accelerate High-Performance RISC-V Data Center Solutions; Company Valuation Now Stands at $3.65 Billion

SiFive, the gold standard for RISC-V processor IP, today announced it has raised $400 million in an oversubscribed Series G financing to accelerate its high-performance data center roadmap. This ...
Design And Reuse

Intel Foundry Achieves Breakthrough with World's Thinnest GaN Chiplet Technology

Intel Foundry has created the world's thinnest gallium nitride (GaN) chiplet — its base silicon measuring just 19 micrometers (μm) thick — harvested from a 300 millimeter (mm) GaN-on-silicon wafer.¹ ...
Design And Reuse

IntoPIX Unleashes Zero‑Latency IP Video Streaming With JPEG XS, IPMX & SMPTE 2110 At NAB Show 2026

Celebrating 20 Years of Innovation in Image and Video Compression. Las Vegas, April 9, 2026 – At NAB Show 2026, intoPIX showcases how professional video workflows can move beyon ...
Design And Reuse

RISC-V SoC supports voice-enabled IoT devices

Espressif Systems is sampling its ESP32-S31 dual-core RISC-V SoC with Wi-Fi 6, Bluetooth 5.4, Thread, Zigbee, and Ethernet. Rich HMI and security features make it well-suited for IoT applications such ...
Design And Reuse

BrainChip Unveils Radar Reference Platform to Bridge the ‘Identification Gap’ in Edge AI

BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, BCHPY), the world’s first commercial producer of ultra-low-power, neuromorphic AI techn ...
Design And Reuse

Rapidus Opens Analysis Center and Rapidus Chiplet Solutions

TOKYO – Rapidus Corporation today announced that it opened an Analysis Center and its Rapidus Chiplet Solutions (RCS). The Analysis Center is a facility adjacent to Rapidus’ Innovative Integration for ...
Design And Reuse

TSMC March 2026 Revenue Report

TSMC (TWSE: 2330, NYSE: TSM) today announced its net revenue for March 2026: On a consolidated basis, revenue for March 2026 was approximately NT$415.19 billion, an increase of 30.7 percent from ...
Design And Reuse

Siemens accelerates AI chip verification to trillion‑cycle scale with NVIDIA technology

Siemens and NVIDIA have achieved a major verification breakthrough, capturing trillions of pre‑silicon design cycles in days using Siemens’ Veloce proFPGA CS combined with NVIDIA’s ...